LIGHT-CURABLE ADHESIVES FOR ELECTRONICS ASSEMBLY  
                 
  Incure offers a wide range of UV light-curable adhesives for electronics assembly. These UV light curing adhesives cure in seconds upon exposure to ultraviolet light are suitable for LCD, OLED connector reinforcement, C-MOS connector, electronic component etc.

 
        
           
  Advantages of Incure Electronic Materials Learn about our Light Curing Systems:    
    Cure In Seconds C9000 / U8000 UV Light Curing Conveyor Systems  
    Solvent Free L9000 Compact UV LED Spot Curing Lamp  
    One Component, No Mixing S10 / S20 Ultra High Intensity Light-Curing Spot Lamp  

 

 

 

Overview of Product Spectrum (Metal Bonder)

 
    Product Description   Color Viscosity Tensile Hardness Elongation  
             cps psi shore %  
    1283

Cures with UV / Visible /  Heat or Actif 398. Good clarity, heat and moisture resistance. Good passive vibration isolation capability. Ideal for relays for circuit breakers in the electronics industry for outdoor use.

 

Clear

400 - 800 5,700 - 9,800 D68 - D78 55  
    1203

Cures tack-free with up to 5,400 PSI on many different metals / glass /  ceramics. Very low linear shrinkage with enhanced excellent moisture and temperature resistance. Good passive vibration isolation capability.

 

Clear

500 - 900 4,400 - 5,400 D59 - D69 400  

 

 

Overview of Product Spectrum (Plastic Bonder)

 
    Product Description   Color Viscosity Tensile Hardness Elongation  
             cps psi shore %  
    1462

Low viscosity, acid-free, multi-substrate / plastic bonder. For electronics industry. Good bonding strength on multiple substrates such as metals, glass and FR4 materials on a single application.

 

  Slightly Amber 300 - 600 2,800 - 6,900 D49 - D59 827  
    1483

Medium viscosity, acid-free, multi-substrate /  plastic bonder. For electronics industry. Good bonding strength on multiple substrates such as metals, glass and FR4 materials on a single application.

 

Slightly Translucent 

 

 
 700 - 1,600 2,800 - 7,000 D55 - D65  915  
    1063

Medium viscosity, acid-free, multi-substrate / plastic bonder. For electronics industry. Good bonding strength on multiple substrates such as metals, glass and FR4 materials on a single application.

 

Clear

1,800 - 3,200 3,300 - 7,000 D58 - D68 380  

 

 

 

Overview of Product Spectrum (Potting)

 
    Product Description   Color Viscosity Tensile Hardness Elongation  
             cps psi shore %  
    3339

Very thick, low water absorption electronics sealant. Provides air-tight seal with ease of peel for rework. Tough yet elongating. Widely use for automotive and electronics industries for its low CTE properties.

 

 

Slight Translucent

27,000 - 50,000 1,100 - 3,400 A12 - A22 71  
    6228HT

Cost efficient epoxy-acrylate, thick viscosity, ultra-low shrinkage and water absorption potting compound for use in sensitive electronic devices. UV / Heat curable. Chemical and vapor resistance.

  Clear 5,000 - 8,000 1,700 - 5,600 D55 - D65 160  
    6213

Cost efficient epoxy-acrylate low viscosity, ultra-low shrinkage and water absorption potting material for use in sensitive electronic devices. Chemical and vapor resistance.

 

   Transparent 500 - 1,200  2,200 - 2,700  D55 - D65   210  
   Package Size: 10 ml syringe / 30 ml syringe / 1 kg Bottle