UV LIGHT CURABLE ENCAPSULANTS  
 

FOR MICROELECTRONIC ASSEMBLY AND IC PROTECTION

 
 
Incure EncapTM UV encapsulants are ideal for applications such as Bare Die Encapsulation, Chip-On-Board, Chip-On-Flex Encapsulation, Chip-On-Glass, Flex Circuit Bonding / Attachment, Multi-Chip Modules, Wire Bonding etc. These one part, no-mix products cure in seconds for immediate inspection in high assembly operations. Excellent proctection on flexible and rigid platforms.

 
        
         
  Advantages of EncapTM - UV Encapsulants   Learn about our Light Curing Systems:      
    Superior Adhesion to PET & Polyimide    C9000 / U8000 UV Light Curing Conveyor Systems    
    Low Stress Under Thermal Cycling   F500 Portable UV Curing Lamp    
    Room Storage      
    Thermal Shock and Moisture Resistant      
                     
    Overview of Product Spectrum  
    Product Description   Color Water Viscosity Hardness Elongation  
             Aborption % cps Shore %  
    3522

Low viscosity encapsulant. Clear, hard, sleek and resilient protective coating thickness of 300 to 4,500 microns on components. Very low water absorption.

  Clear
Liquid
0.30 100 - 200 D84 - D94 4  
    3555

Ultra-low stress, clear electronic component encapsulant. Fast curingwith good light transmission properties. Enhanced moisture and temperture resistance. Does not attack flexible circuit easily.

  Clear
Liquid
0.60 3,300 - 5,000 D63 - D73 32  
    Package Size: 10 ml syringe / 30 ml syringe / 1 kg Bottle / 1 Gallon Pail / 2 Gallon Pail / 18 kg Pail