ELECTRONICS

LIGHT-CURABLE ADHESIVES FOR ELECTRONICS ASSEMBLY  

Incure offers a wide range of UV light-curable adhesives for electronics assembly. These UV light curing adhesives cure in seconds upon exposure to ultraviolet light are suitable for LCD, OLED connector reinforcement, C-MOS connector, electronic component etc.

Fill in your Electronics Application Profile Here

 

Image
Image
Image
Advantages of Incure Electronic Materials                 
  Cure In Seconds                                                           
  Solvent Free                                                                  
  One Component, No Mixing
Learn about our Light Curing Systems:        
C9000 / U8000 UV Light Curing Conveyor Systems      
L9000 Compact UV LED Spot Curing Lamp                    
S10 / S20 Ultra High Intensity Light-Curing Spot Lamp
Uni-Weld™ Series Core Products (Metal Bonder)
Product Product Highlights Substrates Color Viscosity Tensile (psi) Hardness Elongation
1283 Cures with UV / Visible / Heat or Actif 398. Good clarity, heat and moisture resistance. Good passive vibration isolation capability. Ideal for relays for circuit breakers in the electronics industry for outdoor use.
High Performance
Metal/Glass/Ceramics
Clear 600 cps 5,700 - 9,800 D68 – D78
55%

1203 Cures tack-free with up to 5,400 PSI on many different metals / glass / ceramics. Very low linear shrinkage with enhanced excellent moisture and temperature resistance. Good passive vibration isolation capability.
Metal/Glass/Ceramics Clear 700 cps 4,400 - 5,400 D59 – D69 400%
Uni-Weld™ Series Core Products (Plastic Bonder)
Product Product Highlights Substrates Color Viscosity Tensile (psi) Hardness Elongation
1462 Low viscosity, acid-free, multi-substrate / plastic bonder. For electronics industry. Good bonding strength on multiple substrates such as metals, glass and FR4 materials on a single application.
Low Adhesion
Multi-Substrates
(High Strength Plastics)
Slightly Amber 450 cps 2,800 - 6,900 D49 – D59 827%
1483 Medium viscosity, acid-free, multi-substrate / plastic bonder. For electronics industry. Good bonding strength on multiple substrates such as metals, glass and FR4 materials on a single application.
Low Adhesion
Multi-Substrates
(High Strength Plastics)
Slightly Translucent 1,150 cps 2,800 - 7,000 D55 – D65 915%
1063 Low viscosity, acid-free, multi-substrate / plastic bonder. For electronics industry. Good bonding strength on multiple substrates such as metals, glass and FR4 materials on a single application.
Multi-Substrates
(High Strength Plastics)
Clear 2,500 cps 3,300 - 7,000 D58 – D68 380%
Uni-Seal™ Series Core Products (Potting)
Product Product Highlights Substrates Color Viscosity Tensile (psi) Hardness Elongation
6213HT Cost efficient epoxy-acrylate, thick viscosity, ultra-low shrinkage and water absorption potting compound for use in sensitive electronic devices. UV / Heat curable. Chemical and vapor resistance.
Multi-Substrates
(Low Adhesion)
Clear Transparent 6,500 cps 2,200 - 2,700 D55 – D65 430%
3393 Low viscosity and low water absorption electronics sealant.  Provides air-tight seal with ease of peel for rework.  Tough yet elongating.  Widely use for automotive and electronics industries for its low CTE properties. Very Low Strength
Multi-Substrates
 Slightly Translucent  700 cps 300- 3,000 A20 – A30 374%
6213 Cost efficient epoxy-acrylate low viscosity, ultra-low shrinkage and water absorption potting material for use in sensitive electronic devices. Chemical and vapor resistance.
Low Adhesion
Multi-Substrates
Transparent 800 cps 2,200 - 2,700 D55 - D65 430%
6322 Low viscosity, highly resilient (memory retention) and high flexibility out-perform many gaskets provides air-tight sealing.  Available in different colors. Multi-Substrates (Plastics) Clear Transparent 375 cps 3,900-4,200 D17– D27 560%
Package Size: 10 ml syringe / 30 ml syringe / 30 ml squeeze bottle / 100 ml squeeze bottle / 250 ml squeeze bottle / 1 kg Bottle / 1 Gallon Pail / 2 Gallon Pail / 5 Gallon Pail