GASKET
LIGHT-CURABLE FORM-IN-PLACE & CURE-IN-PLACE GASKETS FOR INDUSTRIAL ASSEMBLY

Incure Uni-SealTM offers a wide range of UV light-curable gasket/sealants for industrial assembly. These UV light curing adhesives cure in seconds upon exposure to ultraviolet light.

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Advantages of Uni-SealTM  - FIP/CIP Gasket
 Cure In Seconds!
 Excellent Adhesion to Glass, Plastics & Metals
 One Component, No Mixing
 Low Compression Set - Re-sealable
 Wide Range of Viscosities
 Solvent Free


Learn about our Light Curing Systems: 

C9000 / U8000 UV Light Curing Conveyor Systems
L9000 Compact UV LED Spot Curing Lamp 
S10 / S20 Ultra High Intensity Light-Curing Spot Lamp

 

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Uni-Seal™ 6322 with memory retention capabilities
Click image to watch demostration
  Uni-SealTM Series Core Products
  Product Product Highlights Substrates Color Viscosity Tensile (psi) Hardness Elongation
  1822 Low viscosity bonder / sealant / gasket. Good adhesion to many substrates. Very low shrinkage and water absorption. Air-tight sealing, superior passive vibration absorption capability.  Multi-Substrates

Clear 
Translucent

350 cP 2,400 - 4,900 A59 – A69 250%
  6322 Low viscosity, highly resilient (memory retention) and high flexibility out-perform many gaskets provides air-tight sealing. Available in different colors. MultiSubstrates
(Plastics)
Transparent 400 cP 2,400 - 4,000  D17 – D27 560% 
  3393 Low viscosity and low water absorption electronics sealant. Provides air-tight seal with ease of peel for rework. Tough yet elongating. Widely use for automotive and electronics industries for its low CTE properties. Very Low Strength 
Multi-Substrates
Slight 
Translucent 
600 cP 1,200 - 3,000 A5 – A15 374%
  6213 Cost efficient epoxy-acrylate low viscosity, ultra-low shrinkage and water absorption potting compound for use in sensitive electronic devices. Chemical and vapour resistance.  Multi-Substrates 
(Low Adhesion)
Transparent 800 cP 2,200 - 2,700 D55 – D65 430%
  3718F Flexible encapsulant for electronic devices. Cures in seconds with secondary hear cure option for hidden areas. Bonds to many different substrates Multi-Substrates Slightly Translucent 14,000 cP 2,400 - 5,200 D40 – D50 254%
  3393VT Very thick, low water absorption electronics sealant. Provides air-tight seal with ease of peel for rework. Tough yet elongating. Widely use for automotive and electronics industries for its low CTE properties. Very Low Strength 
Multi-Substrates
Slightly Translucent 20,000 cP 1,200 - 3,000 A5 – A15 374%
  3393GB Gel, low water absorption electronics black sealant.  Provides air-tight seal with ease of peel for rework.  Tough yet elongating.  Widely use for automotive and electronics industries for its low CTE properties. Very Low Strength 
Multi-Substrates

 Dark Translucent Black

>1,000 1,500 - 3,500 A20 – A30 400%
  Above products are available in thicker versions: T (Thick), VT (Very Thick), G (Gel) 
Package Size: 10 ml syringe / 30 ml syringe / 30 ml squeeze bottle / 100 ml squeeze bottle / 250 ml squeeze bottle / 1 kg Bottle / 1 Gallon Pail / 2 Gallon Pail / 5 Gallon Pail
APPLICATION:

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