HIGH TEMPERATURE

HIGH TEMPERATURE EPOXY FOR BONDING AND POTTING

Incure Epo-WeldTM High Temperature Epoxy Adhesives are designed for bonding and potting applications to 204°C.
These high temperature epoxies can be applied to a wide range of substrates, offering exceptional chemical, electrical and mechanical properties.
Epo-WeldTM Series Core Products
Product Product Highlights Substrates Color Tensile Flexural Viscosity Cure Temperature
(psi) (psi) Mixed Shrinkage Resistance
HTE-6418 Two-component epoxy (sealant and encapsulant) bonding material. 3 mins fast-setting, strength starts increasing after 15 mins, full cure in 72hrs. High gloss clear encapsulant, high temperature and chemical resistance.
 Multi-Substrates 
(High Strength) 		 Clear 9,400 145,400 6,500 cP 0.0005 in/in -55 to 155°C
HTE-6481 High Performance, tough and glossy heat cure clear epoxy. Superior peel and shear strength on many substrates. Exceptional high temperature, vibration, impact and abrasion resistance. Dimensional stability, chemicals and solvents resistance.
  Multi-Substrates 
(High Strength) 		 Clear Glossy 21,600 137,500 7,000 cP 0.0005 in/in -55 to 155°C
HTE-6468 Two-component epoxy (sealant and encapsulant) bonding material. 3 mins fast-setting, strength starts increasing after 15 mins, full cure in 72hrs. High gloss black encapsulant, high temperature and chemical resistance.
 Multi-Substrates 
(High Strength) 		 Black Glossy 9,400 145,400 12,500 cP 0.0005 in/in -55 to 155°C
HTE-6498 Two-component epoxy (sealant and encapsulant) bonding material. 3 mins fast-setting, strength starts increasing after 15 mins, full cure in 72hrs. High gloss black encapsulant, high temperature and chemical resistance.
 Multi-Substrates 
(High Strength)		 Clear 9,400 145,500 14,500 cP 0.0005 in/in -55 to 155°C
HTE-5354 Two-part epoxy system for bonding and potting applications requiring good flexibility operating at high temperatures. Bonds various substrates, delivers outstanding performance on application within the operating temperature range.
  Multi-Substrates Clear 1,200 8,000 12,000 cP 0.008 in/in -50 to 200°C
HTE-6491 High Performance, tough and glossy heat cure black epoxy. Superior peel and shear strength on many substrates. Exceptional high temperature, vibration, impact and abrasion resistance. Dimensional stability, chemicals and solvents resistance.
 Multi-Substrates 
(High Strength)		 Black Glossy 21,600 137,500 23,000 cP 0.0005 in/in -55 to 155°C
HTE-5351 Two-part epoxy system for bonding and potting applications  operating at high temperatures. Bonds various substrates. Meets NASA outgassing requirements.
 Multi-Substrates Amber 3,000 10,200 25,000 cP 0.002 in/in -65 to 204°C
HTE-5350 Two-part epoxy system designed for bonding and potting applications operating at high temperatures. Bonds various substrates, with exceptional chemical resistance. Outstanding performance within operating temperature range.
  Multi-Substrates Grey 2,500 11,400 Paste 0.002 in/in -65 to 204°C
HTE-5352 Two-part epoxy system for repair and maintenance of applications operating at high temperatures. Bonds various substrates.
 Multi-Substrates Grey 2,500 12,000 Paste 0.002 in/in -65 to 204°C
HTE-5355 Two-part epoxy system designed for bonding and potting applications operating at high temperatures. Bonds various substrates with exceptional chemical resistance. Outstanding performance within the -56°C to 2015°C temperature range. Meets NASA outgassing requirements.  Multi-Substrates Light Grey 2,350 11,800 Paste 0.004 in/in -55 to 204°C
   Package Size: Pint / Quart / Gallon
   HTE-5350 - for repairing defects in aluminum prior to powder coating.
   HTE-5352 - for repairing defects in cast iron, stainless steel, and steel prior to powder coating.