ENCAPSULANT

UV LIGHT CURABLE ENCAPSULANTS FOR MICROELECTRONIC ASSEMBLY AND IC PROTECTION

Incure EncapTM UV encapsulants are ideal for applications such as Bare Die Encapsulation, Chip-On-Board, Chip-On-Flex Encapsulation, Chip-On-Glass, Flex Circuit Bonding / Attachment, Multi-Chip Modules, Wire Bonding etc. These one part, no-mix products cure in seconds for immediate inspection in high assembly operations. Excellent proctection on flexible and rigid platforms.

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Advantages of Incure Electronic Materials                 
  Superior Adhesion to PET & Polyimide                                                         
  Low Stress Under Thermal Cycling                                                                
 Room Storage
 Thermal Shock and Moisure Resistant
Learn about our Light Curing Systems:
C9000 / U8000 UV Light Curing Conveyor Systems
F500 Portable UV Curing Lamp
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EncapTM Series Core Products
Product Product Highlights Substrates Color Viscosity Tensile (psi) Hardness Elongation
3522 Low viscosity encapsulant. Clear, hard, sleek and resilient protective coating thickness of 300 to 4,500 microns on components. Very low water absorption.
 Low Adhesion Clear 20 cP 150 D84 – D94 4%
3555 Ultra-low stress, clear electronic component encapsulant. Fast curingwith good light transmission properties. Enhanced moisture and temperture resistance. Does not attack flexible circuit easily.
 Multi-Substrates (Low Adhesion) Clear 20 cP 4,150 D63 – D73 32%
Package Size: 10 ml syringe / 30 ml syringe / 30 ml squeeze bottle / 100 ml squeeze bottle / 250 ml squeeze bottle / 1 kg Bottle / 1 Gallon Pail / 2 Gallon Pail / 5 Gallon Pail