LIGHT-CURABLE ADHESIVES FOR ELECTRONICS ASSEMBLY  

 

Advantages of Incure Electronic Materials  
              
  Cure In Seconds                                                           
  Solvent Free                                                                  
  One Component, No Mixing


Learn about our Light Curing Systems

C9000 / U8000 UV Light Curing Conveyor Systems
F100P / F200P Programmable UV Flood Curing Lamps
L1000 High Intensity UV LED Flood Lamps
L9000 Compact UV LED Spot Curing Lamps
S10 / S20 Ultra High Intensity Light-Curing Spot Lamps

Uni-WeldTM Series Core Products (Metal Bonder)
Product	Product Highlights	Substrates	Color	Viscosity	Tensile (psi)	Hardness	Elongation
1283	Cures with UV / Visible / Heat or Actif 398. Good clarity, heat and moisture resistance. Good passive vibration isolation capability. Ideal for relays for circuit breakers in the electronics industry for outdoor use.	High Performance Metal/Glass/Ceramics	Clear	600 cP	5,700 - 9,800	D68 – D78	55%
1203	Cures tack-free with up to 5,400 PSI on many different metals / glass / ceramics. Very low linear shrinkage with enhanced excellent moisture and temperature resistance. Good passive vibration isolation capability.	Metal/Glass/Ceramics	Clear	700 cP	4,400 - 5,400	D59 – D69	400%
Uni-WeldTM Series Core Products (Plastic Bonder)
Product	Product Highlights	Substrates	Color	Viscosity	Tensile (psi)	Hardness	Elongation
1462	Low viscosity, acid-free, multi-substrate / plastic bonder. For electronics industry. Good bonding strength on multiple substrates such as metals, glass and FR4 materials on a single application.	Low Adhesion Multi-Substrates (High Strength Plastics)	Slightly Amber	450 cP	2,800 - 6,900	D49 – D59	827%
1483	Medium viscosity, acid-free, multi-substrate / plastic bonder. For electronics industry. Good bonding strength on multiple substrates such as metals, glass and FR4 materials on a single application.	Low Adhesion Multi-Substrates (High Strength Plastics)	Slightly Translucent	1,150 cP	2,800 - 7,000	D55 – D65	915%
1063	Low viscosity, acid-free, multi-substrate / plastic bonder. For electronics industry. Good bonding strength on multiple substrates such as metals, glass and FR4 materials on a single application.	Multi-Substrates (High Strength Plastics)	Clear	2,500 cP	3,300 - 7,000	D58 – D68	380%
Uni-SealTM Series Core Products (Potting)
Product	Product Highlights	Substrates	Color	Viscosity	Tensile (psi)	Hardness	Elongation
6213HT	Cost efficient epoxy-acrylate, thick viscosity, ultra-low shrinkage and water absorption potting compound for use in sensitive electronic devices. UV / Heat curable. Chemical and vapor resistance.	Multi-Substrates (Low Adhesion)	Clear Transparent	6,500 cP	2,200 - 2,700	D55 – D65	430%
3393	Low viscosity and low water absorption electronics sealant.  Provides air-tight seal with ease of peel for rework.  Tough yet elongating.  Widely use for automotive and electronics industries for its low CTE properties.	Very Low Strength Multi-Substrates	Slightly Translucent	700 cP	300- 3,000	A20 – A30	374%
6213	Cost efficient epoxy-acrylate low viscosity, ultra-low shrinkage and water absorption potting material for use in sensitive electronic devices. Chemical and vapor resistance.	Low Adhesion Multi-Substrates	Transparent	800 cP	2,200 - 2,700	D55 - D65	430%
6322	Low viscosity, highly resilient (memory retention) and high flexibility out-perform many gaskets provides air-tight sealing.  Available in different colors.	Multi-Substrates (Plastics)	Clear Transparent	375 cP	3,900-4,200	D17– D27	560%
Package Size: 10 ml syringe / 30 ml syringe / 30 ml squeeze bottle / 100 ml squeeze bottle / 250 ml squeeze bottle / 1 kg Bottle / 1 Gallon Pail / 2 Gallon Pail / 5 Gallon Pail