ENCAPSULANT
Incure EncapTM UV encapsulants are ideal for applications such as Bare Die Encapsulation, Chip-On-Board, Chip-On-Flex Encapsulation, Chip-On-Glass, Flex Circuit Bonding / Attachment, Multi-Chip Modules, Wire Bonding etc. These one part, no-mix products cure in seconds for immediate inspection in high assembly operations. Excellent proctection on flexible and rigid platforms.
Fill in your Electronics Application Profile HereAdvantages of Incure Electronic Materials
Superior Adhesion to PET & Polyimide
Low Stress Under Thermal Cycling
Room Storage
Thermal Shock and Moisure Resistant
Learn about our Light Curing Systems
Superior Adhesion to PET & Polyimide Low Stress Under Thermal Cycling Room Storage Thermal Shock and Moisure ResistantLearn about our Light Curing Systems
C9000 / U8000 UV Light Curing Conveyor Systems
F100P / F200P Programmable UV Flood Curing Lamps
L1000 High Intensity UV LED Flood Lamps
L9000 Compact UV LED Spot Curing Lamps
S10 / S20 Ultra High Intensity Light-Curing Spot Lamps
| EncapTM Series Core Products | ||||||||
| Product | Product Highlights | Substrates | Color | Viscosity | Tensile (psi) | Hardness | Elongation | |
| 3522 | Low viscosity encapsulant. Clear, hard, sleek and resilient protective coating thickness of 300 to 4,500 microns on components. Very low water absorption. |
Low Adhesion | Clear | 20 cP | 150 | D84 – D94 | 4% | |
| 3555 | Ultra-low stress, clear electronic component encapsulant. Fast curingwith good light transmission properties. Enhanced moisture and temperture resistance. Does not attack flexible circuit easily. |
Multi-Substrates (Low Adhesion) | Clear | 20 cP | 4,150 | D63 – D73 | 32% | |
| Package Size: 10 ml syringe / 30 ml syringe / 30 ml squeeze bottle / 100 ml squeeze bottle / 250 ml squeeze bottle / 1 kg Bottle / 1 Gallon Pail / 2 Gallon Pail / 5 Gallon Pail | ||||||||