THERMALLY CONDUCTIVE

THERMALLY CONDUCTIVE EPOXY    
   
Incure offers a range of thermally conductive adhesives suitable for bonding copper heat exchange tube to steel cores, aluminium heat sink to power semiconductor devices. These thermally conductive adhesives exhibit excellent mechanical strength, low shrink rate and thermal properties. Incure thermally conductive materials provide solutions to a variety of electrical, electronic and thermal design problems throughout industry.
Overview of Product Spectrum
Product Product Highlights Ratio Color Viscosity (Mixed) cP Volume Resistivity ohms-cm Dielectric Strength volts/mil  Thermal Conductivity Btu-in/hr-ft2-°F Temp. Resistance °C
                 

TC-9042

Thermally Conductive,
Aluminum-Filled,
Two Part Epoxy Paste
100:12 Grey 10,000 1.0 x 105 50 12.5 300
TC-9051
Thermally Conductive,
Aluminum Nitride Filled,
1:1 Epoxy Paste
1:1 Grey 35,000 1.0 x 1015 250 8.5 204
TC-9033 Thermally Conductive,
Aluminum-Filled,
1:1 Epoxy Paste
1:1 Grey Paste 1.0 x 105 80 9.0 204
Package Size: Pint 473.18 ml / Quart 946.35 ml / Gallon 3.79 ltr